B4C boron carbide for sapphire wafer grinding

Boron carbide F230 for sapphire wafer grinding

Boron carbide abrasives have good performance in the double-sided grinding of sapphire and the thinning and polishing of sapphire-based LED epitaxial wafers.

Due to the high strength and hardness of the sapphire crystal, it has brought great difficulties to the processing enterprises. From the point of view of materials and grinding academia, the best materials for processing and grinding sapphire crystals are synthetic diamond, boron carbide, and silicon dioxide. Due to the excessive hardness of artificial diamond, the surface of the sapphire wafer will be scratched when grinding, which will affect the light transmittance of the wafer, and it is expensive. However, insufficient hardness of silica and poor grinding force are time-consuming and labor-intensive in the grinding process. Therefore, boron carbide abrasives are ideal materials for processing and grinding sapphire crystals.

boron carbide for sapphire wafer grinding is produced by high temperature smelting boric aid and carbon materails in electric furnaces.