Application of Boron Carbide in Sapphire Wafer LED
Boron carbide abrasives have good performance in double-sided grinding of sapphire wafers and back thinning and polishing of sapphire-based LED epitaxial wafers.
Due to the high strength and hardness of the sapphire crystal, it has brought great difficulties to the processing enterprises. From the point of view of materials and grinding academia, the relatively good materials for processing and grinding sapphire crystals are synthetic diamond, boron carbide, and silicon carbide. Due to the excessive hardness of artificial diamond, the surface of the sapphire wafer will be scratched when grinding, which will affect the light transmittance of the wafer, and it is expensive. However, the hardness of silicon carbide is insufficient and the grinding force is poor, which is time-consuming and labor-intensive in the grinding process. Therefore, boron carbide abrasives become ideal materials for processing and grinding sapphire crystals.