boron Carbide B4C for gem grinding polishing

boron Carbide B4C for gem grinding polishing

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boron Carbide B4C for gem grinding polishing

Boron carbide have good performance in the grinding of gem and polishing of epitaxial wafers.

Due to the high strength and hardness of the gem it has brought great difficulties to the processing enterprises. From the point of view of materials and grinding academia, the best materials for processing and grinding gem crystals are synthetic diamond, boron carbide, and silicon dioxide. Due to the excessive hardness of artificial diamond, the surface of the gem will be scratched when grinding, which will affect the light transmittance of the wafer, and it is expensive. However, insufficient hardness of silica and poor grinding force are time-consuming and labor-intensive in the grinding process. Therefore, boron carbide abrasives are ideal materials for processing and grinding gem crystals.

 

Boron carbide, also known as black diamond, is an inorganic substance with a chemical formula of B4C, usually gray-black micropowder. It is one of the three hardest materials known (second only to diamond and cubic boron nitride). It is used in gem grinding polishing tankarmor, bulletproof vests and many industrial applications. Its Mohs hardness is about 9.6

boron Carbide B4C for gem grinding polishing boron Carbide B4C for gem grinding polishing

 

boron Carbide for gem grinding is produced by high temperature smelting boric aid and carbon materails in electric furnaces.

boron Carbide for gem grinding chemical composition(%)

B %

78-81

C%

17-22

Fe2O3%

0.2-0.4

                                       B4C%

95-99

boron Carbide for gem grinding physical properties

Color

Black

Molecular Formula

B4C

Density & phase

2.52g/cm3   Solid

Solubility In Water

Insoluble

Melting Point

2450°C

Boiling point

3500°C

Crystal Structure

Rhombohedral

Mohs Hardness

9.6

Micro Hardness

4950kgf/mm2


Bo
ron carbide Avaliable Size                 

size

particle size distribution( um)

B%

C%

Fe2O3

B4C%

F60315-21578-8117-220.2-0.497-99
F80200-16078-8117-220.2-0.497-99
F100160-12578-8117-220.2-0.497-99
F120125-10078-8117-220.2-0.496-98
F150100-8077-8017-220.2-0.496-98
F18080-6377-8017-220.2-0.496-98

F230

53±3

77-80

17-22

0.3-0.5

96-97

F240

44.5±2

77-80

17-22

0.3-0.5

96-97

F280

36.5±1.5

77-80

17-22

0.3-0.5

96-97

F320

29.2±1.5

76-79

17-21

0.3-0.6

95-97

F360

22.8±1.5

76-79

18-22

0.3-0.7

94-97

F400

17.3±1

76-79

18-22

0.3-0.7

94-97

packaging                                                                                                   

Sapphire grinding boron carbide Packing Details  

1. 20kgs paper bag
2. 1mt wooden box

boron Carbide B4C for gem grinding polishingboron Carbide B4C for gem grinding polishing

 

boron Carbide grinding for Sapphire Wafer factory

boron Carbide B4C for gem grinding polishingboron Carbide B4C for gem grinding polishingboron Carbide B4C for gem grinding polishingboron Carbide B4C for gem grinding polishingboron Carbide B4C for gem grinding polishingboron Carbide B4C for gem grinding polishingboron Carbide B4C for gem grinding polishing

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